The topics of relevance for the conference papers include but not limited to the following:
Please download the CFP flyer here (Click)

AI Chip Architectures and Accelerators
NPUs, TPUs, and reconfigurable AI accelerators
In-memory and near-memory computing architectures
Sparse neural network accelerators and pruning-aware hardware
Heterogeneous platforms integrating CPU, GPU, NPU, and FPGA

Advanced Semiconductor Devices and Process Technologies
Sub-3nm logic devices: GAA-FETs, CFETs, and 2D material transistors
Advanced lithography (EUV, high-NA EUV) and patterning techniques
Novel interconnects and backside power delivery networks
Monolithic 3D integration and chiplets for heterogeneous integration

Memory Technologies and Storage for AI Systems
Emerging non-volatile memories (MRAM, ReRAM, PCM) and logic integration
HBM, processing-in-memory (PIM), and memory-centric architectures
3D NAND, storage-class memory, and AI-optimized storage hierarchies
Cache design, memory consistency, and data placement for AI workloads

Design Automation, EDA, and AI-Driven IC Design
AI/ML-assisted EDA for logic synthesis, placement, and routing
RL-driven chip floorplanning and physical design optimization
Automated design space exploration and RTL-to-GDSII generation
AI-driven yield prediction, defect detection, and reliability optimization

System-Level Integration and Software-Hardware Co-Design
Chiplet-based SiP and advanced packaging (2.5D/3D)
Compiler and runtime optimization for AI accelerators
Hardware-aware NAS and model compression
Scalable training/inference systems for large language models (LLMs)

Emerging Paradigms, Reliability, and Security
Neuromorphic computing and spiking neural network (SNN) hardware
Quantum, optical, and analog AI accelerators
Hardware security: side-channel attacks, anti-counterfeiting, and trust anchors
Reliability: aging, thermal management, and fault-tolerant design