Registered and presented full papers will be included in the AICSD 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.

Taking place on October 15–17, 2027, the 2027 International Conference on AI Chips and Semiconductor Design (AICSD 2027) is a premier forum focused on driving breakthroughs in AI hardware and semiconductor innovation. The conference will convene chip architects, design engineers, researchers, and industry executives to share transformative ideas and real-world solutions shaping the next generation of intelligent computing systems.
With a spotlight on the convergence of AI-driven algorithms and advanced chip fabrication, AICSD 2027 will delve into AI-specific accelerators, novel memory and compute-in-memory paradigms, heterogeneous and 3D integration, low-power design techniques, chiplet-based platforms, alongside pivotal applications in edge intelligence, autonomous machines, and cloud-scale AI infrastructures. Through fostering dynamic exchanges across academia and industry, the conference seeks to accelerate the path from lab to market—delivering performant, scalable, and energy-conscious semiconductor technologies that underpin the future of artificial intelligence.
First Round
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Abstract Submission Due |
April 9, 2027 |
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Full Submission Due |
April 24, 2027 |
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Author Notification |
June 19, 2027 |
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Registration Due |
August 4, 2027 |
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Final Paper Submission Due |
September 4, 2027 |
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Main conference |
October 15-17, 2027 |
Manuscripts can be submitted via the Submission System
If you have any questions during the submission process, please send an email to: ×.
Only original papers will be considered. The manuscripts must not be previously published or accepted for publication elsewhere. Must not be under review by any other conference or publication during the review cycle.
Authors are encouraged to check the similarity index of their paper before submission. Papers suspected of plagiarism, self-plagiarism, repeated publication, etc. will be rejected without further consideration.
The Best Papers will be nominated by the Award Committee from among the Oral and Poster sessions. The winners of these awards will be announced at the closing ceremony.
Poster presenters should prepare an A1-sized poster (594 x 841 mm) for display at the conference. Please download the Poster Template here.
Registered and presented full papers will be included in the AICSD 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.

Topics of Interest include but not limited to:
| · AI Chip Architectures and Accelerators · Advanced Semiconductor Devices and Process Technologies · Memory Technologies and Storage for AI Systems · Design Automation, EDA, and AI-Driven IC Design |
· System-Level Integration and Software-Hardware Co-Design · Emerging Paradigms, Reliability, and Security · Other Related Topics |