Mark your calendars for the 2027 International Conference on AI Chips and Semiconductor Design (AICSD 2027), taking place October 15–17, 2027. We are now accepting original research contributions from academics, industry practitioners, and technology innovators across the full spectrum of AI hardware and semiconductor engineering. Topics of interest span chip architectures for deep learning, energy-efficient accelerators, advanced node processes, 3D stacking and chiplets, in-memory and near-memory computing, electronic design automation, testing and reliability, as well as novel materials and device concepts. This is your opportunity to showcase your work, exchange ideas with global experts, and influence the direction of next-generation intelligent systems. We look forward to receiving your manuscripts—submit today and be part of this exciting event!