AICSD 2027 invites original, high-quality research contributions from academia, industry, and government laboratories for the 2027 International Conference on AI Chips and Semiconductor Design, taking place on October 15–17, 2027. Topics of interest span chip architectures for deep learning, energy-efficient accelerators, advanced node processes, 3D stacking and chiplets, in-memory and near-memory computing, electronic design automation, testing and reliability, as well as novel materials and device concepts. Submissions should present significant, unpublished work and will undergo peer review. Accepted papers will be presented at the conference and included in the proceedings. We welcome papers, posters, and industry contributions that advance AI chips and semiconductor design. Please click here for submission guidelines and deadlines.